WSB自動(dòng)粘片機(jī)簡介：

The Logitech WSB unit offer premium bonding for the processing of fragile semiconductor wafers such as Silicon and Gallium Arsenide.

The bonding unit is designed to minimise breakage with these expensive materials, whilst retaining the highest quality of sample yield.

WSB自動(dòng)粘片機(jī)特點(diǎn)：

• Automated process cycle

• Excellent wafer to support disc parallelism

• Process Repeatability

• 4” or 6” wafer capacity

• Single or multiple wafer bonding